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Price: 19.55 GBP
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Akasa T5 Pro-Grade+ heat sink compound Thermal paste 5.2 W/mK 5 g
T5 Pro-Grade+ Easily apply ultra-performance hybrid thermal paste to your CPU and GPU designed for highly efficient computer setups. Perfect for overclocking enthusiasts with 10-20 applications. - Designed with hybrid silicone and nano-diamond particles for ultra-performance - Non-curing and non-electrically conductive properties - Conveniently included wipes and spreader Nano-Diamond Particles for Superior Heat Transmission Use of hybrid silicone and nano diamond micro particles ensures minimal thermal resistance for quick and efficient heat transmission. Getting the most out of your processor air and liquid heatsink cooler. Making it perfect for overclockers. Easy and Safe Application Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components. Conveniently Included Wipes and Spreader Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink. Application Thermally conductive compound Thermal Conductivity 5.2 W/mK Specific Gravity 2.6 Form Non-curing compound Operating Temperature -50C to 250C Thermal Resistance 0.04C-cm/W @ 60 psi Colour Grey Viscosity 6000000 (mPa.s/ 22C) Weight 5g
Disclaimer: Product information, including title, description, and images, is sourced/provided by our affiliate partner, Quzo UK.
Disclaimer: Some of the links on this website are affiliate links, meaning we may earn a commission if you click through and make a purchase. This comes at no additional cost to you.
By clicking the button above, you acknowledge that you will be redirected to a third-party website and agree to their terms and conditions.
Product information, including title, description, and images, is sourced/provided by our affiliate partner, Quzo UK.
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Share this product with a friend:
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